The MEI 909 ultrasonic wedge bonder is a simple yet very efficient semi-automatic bonder. It is specifically useful for cerdips, side brazed packages and small hybrids. Unique gravity fed/damper controlled bonding arm ensures a uniform impact force. Two bonding levels can be preset. The user only manipulates the workstage and triggers the bond. Simple mechanics make maintenance very easy. The aluminum or gold wire size it uses is .7-3 mil The weight of this machine is 50 lbs and the size is 12″ W X 18″D X 21″H.
Queen City Semiconductors can offer full support on these machines when you purchase them here .
Please note: Queen City Semiconductors has thousands of machines in stock and the photo of the item taken at our facility is for reference. There may be multiple models of this item in stock. Queen City Semiconductors will email a video of any machine purchased under payment terms agreed, demonstrating operation (prior to shipment) at your request.
Queen City Semiconductors has been selling refurbished semiconductor manufacturing equipment for over 40 years. Experienced technicians and a vast inventory of machines and parts enables Queen City Semiconductors to offer support on the majority of tools we sell….for many years after the Original equipment manufacturer (OEM) does not.
Many tools are also listed on ebay if you prefer to purchase online immediately.
To avoid Ebay commissions, you can also place most machines on hold immediately by calling or texting J on his cell phone (978) 771-0481.