HYBOND 616

SKU: Hybond-616-Ultrasonic-Bonder Equipment Type: Brand:

HYBOND 616 ULTRASONIC PEG BONDER

HYBOND’s Model 616 ultrasonic single channel peg bonder has

been designed to perform ultrasonic attachment of insulated or

bare wire/ribbon. Applications include hard disk head stack

assemblies, head gimbal assemblies, microwave and

sensor circuits.

STANDARD FEATURES

Bond level sensor system which stops Z

movement at bonding level and activates bond force/ultrasonics sequence.

Front panel control of bond head search height

which indexes from last bonding level.

Bond head vertical movement controlled by

push button or electrical foot actuation (manual or automatic).

Electrical chassis with modular circuit boards

for control functions to allow simplified

trouble shooting and repair.

HYBOND standard work platform with 4:1

manipulator.

Force system factory adjusted to prevent

variation.

Anti-static equipment enclosure.





Interested in this Equipment? Contact Us Today!

Please note: Queen City Semiconductors has thousands of machines in stock and the photo of the item taken at our facility is for reference. There may be multiple models of this item in stock. Queen City Semiconductors will email a video of any machine purchased under payment terms agreed, demonstrating operation (prior to shipment) at your request.

We also list some of our equipment ready to go now on Ebay!

Queen City Semiconductors has been selling refurbished semiconductor manufacturing equipment for over 40 years. Experienced technicians and a vast inventory of machines and parts enables Queen City Semiconductors to offer support on the majority of tools we sell….for many years after the Original equipment manufacturer (OEM) does not.

Many tools are also listed on ebay if you prefer to purchase online immediately.

To avoid Ebay commissions, you can also place most machines on hold immediately by calling or texting J on his cell phone (978) 771-0481.

Reasons to Choose J.M. Industries, Inc.